The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
May. 11, 2000
Ryozo Morita, Nagoya, JP;
Ryoji Takashi, Nagoya, JP;
Satoshi Tomita, Okazaki, JP;
Takashi Shinoda, Aichi-gun, JP;
Keijiro Oka, Nagoya, JP;
Kabushiki Kaisya Meiki Seisakusyo, Obu, JP;
Abstract
Mold clamping apparatus is disclosed which includes: an electrically-operated movable-platen-driving device of ball-screw type having a first ball-screw shaft supported by one of a movable and a rear platens, a first ball-nut threaded-engaged with the first ball-screw shaft and supported by the other of the movable and rear platens, and a movable-platen driving device for rotating the first ball-screw shaft and nut relative to each other so as to generate a relative longitudinal motion of the first ball-screw shaft and nut so that said movable platen is moved toward and away from a stationary platen to close and open the mold; a pressure-generating cylinder device having a pressure-generating piston moved by the relative longitudinal motion of the first ball-screw shaft and nut in order to generate a hydraulic pressure; and a mold clamping cylinder device adapted to generate a mold clamping force based on the hydraulic pressure applied from the pressure-generating cylinder device; and an engaging device which is operable for connecting a mold clamping ram of the mold clamping cylinder device with the movable platen, for applying the mold clamping force to the movable platen. The method of controlling operation of the apparatus is also disclosed.