The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Sep. 10, 2001
Takuya Inoue, Mie, JP;
Yuki Kawakita, Mie, JP;
Hiroshi Kawauchi, Osaka, JP;
Kouji Ohuchi, Osaka, JP;
Other;
Abstract
A master curve indicating correlation between a bending life and a distortional change quantity of a wire is previously acquired. The master curve is acquired by repetitively bending a single wire and analyzing (CAE analysis with a computer or the like) a distortional change quantity (&Dgr;&egr;) of the surface of its insulating layer while actually measuring the bending life. Then, the distortional change quantity (&Dgr;&egr;) of the surface of the insulating layer of the wire or the like regarded as the object for predicting the bending life is calculated (CAE analysis or the like). The bending life of the wire or the like is predicted by collating the calculated distortional change quantity (&Dgr;&egr;) of the wire or the like serving as the prediction object with the aforementioned master curve. The bending life can be correctly predicted regardless of product conditions of the wire or the like.