The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Oct. 04, 2000
Masahiro Aratani, Okazaki, JP;
Yasuaki Makino, Okazaki, JP;
Denso Corporation, Kariya, JP;
Abstract
A semiconductor pressure sensor in which a semiconductor sensor element is contained in a package which is made by assembling a first case and a second case, and which have simple structure with low cost. The semiconductor pressure sensor is generally made up of a sensor element made of semiconductor; a sensor case made of resin; plural leads insert-formed into the sensor case so as to be partly exposed from the sensor case, wherein the leads is electrically connected to the sensor element; and a connector case assembled with the sensor case for covering the sensor element. The connector case has a flange portion which is provided with a cover portion, and a surround portion protruding from the cover portion for surrounding an exposed portion of the leads. The surround portion and the exposed portion form a connecting portion which can be connected with an external terminal. Hence, connecting function of the sensor can be realized with simple structure without additional connecting members.