The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Oct. 26, 2000
Applicant:
Inventors:
Yugo Koyama, Ina, JP;
Kazunori Sakurai, Chino, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A wire bonding method comprising: disposing a plurality of leads ( ) aligned in an imaginary plane (P) around the periphery of a semiconductor chip ( ) having a plurality of electrodes ( ) aligned on an imaginary straight line (L ); bonding wires ( ) to the electrodes ( ); bending the wires ( ) toward the leads ( ) as viewed from a direction perpendicular to the imaginary plane (P); and bonding the wires ( ) to the leads ( ).