The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Jan. 03, 2001
Applicant:
Inventors:
Jon Zuo, Lancaster, PA (US);
Scott D. Garner, Lititz, PA (US);
Assignee:
Thermal Corp., Stanton, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/310 ;
U.S. Cl.
CPC ...
H01L 2/310 ;
Abstract
A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.