The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2002

Filed:

Mar. 28, 2001
Applicant:
Inventors:

Shinobu Yamazaki, Tenri, JP;

Kazuya Ishihara, Souraku-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/994 ;
U.S. Cl.
CPC ...
H01L 2/994 ;
Abstract

A semiconductor device has a diffusion layer formed on a silicon substrate, an interlayer insulator which covers a surface of the silicon substrate and whose surface is planarized, and a dielectric capacitor composed of a lower electrode connected to the diffusion layer via a buried conductive layer which is buried within a contact hole opened in the interlayer insulator and which is formed of a barrier metal layer composed of a contact plug, a low resistance layer and tantalum silicon nitride, and a dielectric film formed on the lower electrode, and an upper electrode. The lower electrode has a side-wall sloped configuration that its cross-sectional area monotonously increases from the buried conductive layer side toward the. upper dielectric film. Thus, a high-integration semiconductor device which allows the lower electrode to be micro-fabricated and enables lower-voltage operation and higher reliability can be obtained.


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