The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Jun. 18, 2001
Yatsuharu Yokota, Hachioji, JP;
Yokota Technica Limited Company, Tokyo, JP;
Abstract
A reflow soldering apparatus using circulated heated gas to solder electronic components to a printed circuit board while transporting the printed circuit board mounted with electronic components on a conveyor chain. A plurality of gas passages for inflow of heated gas which have openings facing the circuit board, are provided at intervals in the transport direction of the conveyor chain. A first passage is provided for the flow of heated gas into the fan from an opening different from the opening for inflow and formed in the intermediate portion of the gas passage, and a second passage is provided for the flow of heated gas into the fan from openings formed on both ends of the gas passage.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile