The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Jul. 31, 2000
Applicant:
Inventors:
Martin P. Goetz, Discovery Bay, CA (US);
Sammy K. Brown, Los Gatos, CA (US);
George E. Avery, Saratoga, CA (US);
Andrew K. Wiggin, San Carlos, CA (US);
Tom L. Todd, San Jose, CA (US);
Sam Beal, Mountain View, CA (US);
Assignee:
Alpine Microsystems, Inc., Campbell, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling
Goetz, Martin. (2002). Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact (U.S. Patent No. 6436735). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6436735
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile