The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Aug. 25, 1997
Masaaki Sakata, Nagano-ken, JP;
Shoji Takahashi, Nagano-ken, JP;
Kenichi Shimodaira, Nagano-ken, JP;
Injex Corporation, Nagano, JP;
Abstract
A highly reliable sintered compact which can be readily and safely produced, and a method for producing such sintered compact are provided. The sintered compact is preferably formed into a heat sink which comprises a heat sink main body The heat sink main body comprises a substrate a plurality of projections integrally formed with the substrate on its heat dissipation surface, and a molded frame integrally formed with the substrate to surround the projections On each corner of the substrate is formed a circular molded hole The opposite surface of the substrate is formed into a contacting surface which is adapted to be in contact with the heat generating semiconductor chip, and this contacting surface is surface treated, for example, by plating. The sintered compact is produced from metal powders, and it comprises at least one metal selected from tungsten and molybdenum and 2 to 50% by weight of silver. The sintered compact further comprises not more than 10% by weight of a transition metal.