The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2002

Filed:

Aug. 10, 1999
Applicant:
Inventors:

Eiji Toyoda, Osaka, JP;

Makoto Namikawa, Osaka, JP;

Kouichi Hashimoto, Osaka, JP;

Seiichiro Shirai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/120 ; H01L 2/1027 ; H01L 2/13065 ;
U.S. Cl.
CPC ...
B32B 3/120 ; H01L 2/1027 ; H01L 2/13065 ;
Abstract

The present invention is intended to collectively remove unnecessary resist material and side wall protective film after dry etching by side wall protection process, making it possible to simplify the process for the preparation of semiconductors, etc. The process according to the present invention comprises removing unnecessary resist material ( ) left behind after dry etching by side wall protection process with a resist pattern ( ) present on a semiconductor substrate ( ) as a mask and side wall protective film ( ) deposited on the side wall ( ) of pattern, said process comprising the steps of applying an pressure-sensitive adhesive sheet ( ) to said substrate ( ), heating the pressure-sensitive adhesive layer ( ) under pressure so that the pressure-sensitive adhesive ( ) comes in contact with up to the side wall ( ) of pattern, and then collectively peeling said pressure-sensitive adhesive sheet ( ), said resist material ( ) and said side wall protective film ( ) off said substrate.


Find Patent Forward Citations

Loading…