The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2002

Filed:

Dec. 16, 1998
Applicant:
Inventors:

Henry C. Chang, San Jose, CA (US);

Cherngye Hwang, San Jose, CA (US);

Robert Otto Schwenker, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/127 ; H04R 3/100 ;
U.S. Cl.
CPC ...
G11B 5/127 ; H04R 3/100 ;
Abstract

A method of making a magnetic head that has a read head with a track width includes the steps of depositing a read track width defining material layer on a read sensor material layer; forming a bi-layer photoresist mask on the read track width defining material layer that masks a read track width defining layer portion of the read track width defining material layer; removing by reactive ion etching (RIE) a portion of the read track width defining material layer not masked by the photoresist mask to form the read track width defining layer portion with exposed first and second side edges that are spaced apart a distance equal to the track width; removing by ion milling a first portion of the read sensor material layer not masked by the read track width defining layer portion to form a second portion of the read sensor material layer with exposed first and second side edges that have a width equal to the track width; depositing hard bias and lead material layers on the photoresist mask in contact with the first and second side edges of each of the second portion of the read sensor material layer and the read track width defining layer portion; and removing the photoresist mask, thereby lifting off a portion of the hard bias and lead material layers leaving first and second hard bias and lead layers connected to the first and second side edges of each of the second portion of the read sensor material layer and the read track width defining layer portion.


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