The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Mar. 03, 1999
Electronic component having improved soldering performance and adhesion properties of the lead wires
Makoto Aoyama, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
Electrodes of the electronic component chip is electrically connected with the end parts of the leads and the electronic component chip and the end parts of the leads are covered by the package with the leads which are extended out from the package are bent along the outer wall of the package, and a solder bump of low melting point is held in the gap between the leads and the package. By adopting this structure, soldering performance in mounting can be improved by a simple work while securing the moisture resistance between the leads and the package, and without requiring the work of number of steps of solder plating on the exposed leads after molding.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile