The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Jan. 19, 2001
Applicant:
Inventor:
Hirokazu Saito, Ome, JP;
Assignee:
Other;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/306 ;
U.S. Cl.
CPC ...
H01L 2/306 ;
Abstract
A flexible wiring board is provided which is made of a relatively thin polyimide film and, thus, can be bent easily. Therefore, the flexible wiring board can be bent easily in the vicinity of a semiconductor chip mounting region without forming slits for facilitating the bending in the film substrate. As a result, it is possible to decrease the length of that portion of the flexible wiring board which is positioned ahead of the semiconductor chip mounting region.