The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Mar. 08, 2001
Hideko Ando, Hamura, JP;
Hiroshi Kikuchi, Hidaka, JP;
Ikuo Yoshida, Musashimurayama, JP;
Toshihiko Sato, Sayama, JP;
Tomo Shimizu, Ome, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A central portion of a main face of a package substrate is mounted with a memory chip using face down bonding by a flip chip bonding system. Further, a plurality of chip condensers are mounted at vicinities of the memory chip . A clearance between a main face (lower face) of the memory chip and a main face of the package substrate is filled with underfill resin (seal resin) constituting a seal member for achieving protection of connecting portions and for relaxation of thermal stress. An outer edge of the underfill resin is extended to an outer side of the memory chip and covers entire faces of the chip condensers mounted at vicinities of the memory chip