The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2002

Filed:

Jul. 20, 1999
Applicant:
Inventors:

Mark Ramsbey, Sunnyvale, CA (US);

Unsoon Kim, Santa Clara, CA (US);

Kenneth Wo-Wai Au, Fremont, CA (US);

David H. Chi, Sunnyvale, CA (US);

James Markarian, Los Altos, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/7108 ; H01L 2/976 ;
U.S. Cl.
CPC ...
H01L 2/7108 ; H01L 2/976 ;
Abstract

A single interpoly dielectric layer is provided for use in semiconductor devices. The single interpoly dielectric layer being formed of silicon graded such that certain regions within the single interpoly dielectric layer are either oxygen-rich or nitrogen-rich. The single interpoly dielectric layer can be formed in-situ within a single deposition tool. In certain embodiments, the resulting single interpoly dielectric layer can be made thinner and/or can be formed to provide improved dielectric characteristics when compared to a conventional oxide-nitride-oxide (ONO) interpoly dielectric layer that has three separate and unique layers. Thus, the single interpoly dielectric layer is highly desirable for use in reduced-size semiconductor devices and/or semiconductor devices requiring improved data retention capabilities, such as non-volatile memory cells.


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