The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Dec. 14, 2000
Kenji Maeda, Osaka, JP;
Takashi Takata, Shiga, JP;
Hiroki Naraoka, Osaka, JP;
Hajime Homma, Osaka, JP;
Shigeru Nonoyama, Osaka, JP;
Yoshiyuki Arai, Kyoto, JP;
Yuichiro Yamada, Kyoto, JP;
Fumito Ito, Osaka, JP;
Matsushita Electronics Corporation, Osaka, JP;
Abstract
The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.