The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Feb. 22, 2001
Applicant:
Inventors:
Gi-young Jeon, Bucheon, KR;
Eul-bin Im, Bucheon, KR;
Byeong Gon Kim, Bucheon, KR;
Eun-ho Lee, Bucheon, KR;
Assignee:
Fairchild Korea Semiconductor Ltd., Kyungki-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/334 ;
Abstract
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.