The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Apr. 23, 2001
Masao Shimada, Tokyo, JP;
NEC Corporation, , JP;
Abstract
A surface of a semiconductor wafer having a plurality of semiconductor elements thereon is laminated on a first wafer holding substrate. Subsequently, the whole rear surface of the semiconductor wafer is coated with a first conductive layer. Then a second conductive layer is selectively formed thereon. Then, a rear surface side glass substrate is laminated on the first and second conductive layer. Subsequently, the first wafer holding substrate is peeled off. Subsequently, the semiconductor wafer is selectively etched so as to be separated into semiconductor elements. Then, the first conductive layer is connected to a ground potential to measure electrical characteristics of the semiconductor elements and sort the semiconductor elements into non-defectives and defectives. Then, the first conductive layer is selectively etched so as to be separated into chips and thus semiconductor pellets are formed. Finally, the second wafer holding substrate is peeled off.