The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2002

Filed:

Jan. 27, 2000
Applicant:
Inventor:

Hideki Hashizume, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract

A method of producing an optical module having an optoelectronic semiconductor device, a lens, and a resin housing provided with a portion for mounting the optoelectronic semiconductor device, the lens being built into the resin housing, the optoelectronic semiconductor device being mounted in the resin housing so that the lens and the optoelectronic semiconductor device are positioned coaxially, wherein a primarily molded piece ( ) is produced with a resin by insert-molding a spherical lens ( ) so as to hold the spherical lens, and then, the primarily molded piece is secondarily molded with a resin into a final shape of a housing having an optoelectronic semiconductor device mount portion ( ) and a receptacle bore ( ) by further insert-molding the primarily molded piece. In this manner, the resin housing ( ) with the built-in spherical lens is produced in the two molding steps. The lens can be fixed to the housing speedily and easily without using any resin adhesive agent or any welding glass. Moreover, the optical module is excellent in weather resistance and high in reliability and can be produced inexpensively.


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