The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
Aug. 18, 2000
Valerie Vivares, Palo Alto, CA (US);
Robert Newman, Santa Clara, CA (US);
Edwin R. Fontecha, San Jose, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method of simultaneously electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically conductive tie bars and associated extensions, comprises steps of simultaneously electrically contacting each feature of a first one of the circuit patterns with a multi-fingered electrical contactor, and applying an electrical potential to the contactor to effect simultaneous electroplating on the circuit patterns on both sides of the substrate. According to an embodiment of the invention, the multi-fingered contactor comprises an array of electrically conductive wires, rods, or filaments extending from one surface of a metal plate. The invention finds particular utility in the fabrication of ball grid array (BGA) semiconductor device packages.