The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2002

Filed:

Jun. 16, 2000
Applicant:
Inventor:

Yasuhiro Annoura, Shizuoka-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41N 1/08 ;
U.S. Cl.
CPC ...
B41N 1/08 ;
Abstract

The present invention discloses a planographic printing plate having a notched portion on its surface having a required size, and having smaller burrs at a rear face, and a planographic printing plate cutting device and a planographic printing plate cutting method for forming such a planographic printing plate by cutting. The planographic printing plate cutting device of the present invention includes an upper roller for forming a recessed section at the planographic printing plate. The upper roller, which is formed substantially into a disc shape as a whole, has a pressing portion parallel to a web (the planographic printing plate), and a slope portion that is slanted with respect to the surface of the web at a predetermined inclination. This upper roller presses the web such that a sloped face (recessed section) that is slanted with respect to the surface of the web is formed. Next, a shearing roller shears the web at the sloped face such that a remaining portion of the sloped face forms a notched portion. Because formation of the notched portion and the shearing process are carried out as separate processes by separate members, a notched portion having a required size can be formed at the surface, and burrs at the rear face can be reduced.


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