The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2002
Filed:
May. 30, 2000
Applicant:
Inventors:
Monika Bauer, Regensburg, DE;
Klemens Ferstl, Regensburg, DE;
Jens Pohl, Bernhardswald, DE;
Johann Winderl, Wackersdorf, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 4/300 ; B23K 3/700 ; B23K 3/100 ;
U.S. Cl.
CPC ...
H01K 4/300 ; B23K 3/700 ; B23K 3/100 ;
Abstract
A method for bonding conductors onto semiconductor components is disclosed, where an opening is provided in an insulation layer on a semiconductor component. At least one conductor extends across the opening, where the conductor is bonded onto the semiconductor component by a bonding tool, which bends the conductor in the region of the opening toward the semiconductor component. Prior to the bonding, the conductor is severed in the region of the opening.