Efficient process tool utilization in semiconductor manufacturing using an additional process tool state

Abstract

A method, system, and storage medium for increasing the efficiency of integrated circuit (IC) manufacture by improvements in manufacturing equipment usage are provided. Process tools are assigned to one of three operating states: up, down, or conditional. In the up state, process tools are available for manufacturing. After certain manufacturing steps, the quality of the ICs being made upon wafers is evaluated. If potentially defective ICs are found, process tools that have processed the wafer may be placed in the conditional state. In this state, process tools are allowed to continue manufacturing, albeit only for a limited period. The conditional state gives personnel time to determine which process tool is responsible for the defective product. The responsible process tool is then placed in the down state while all others are placed back in the up state. Once the problem with the process tool in the down state is presumably repaired, it is placed in the conditional state. If the limited quantity of wafers then processed by the process tool are found to be acceptable, the tool is placed in the up state; otherwise, it is placed back in the down state. The conditional state allows personnel to investigate the problem without halting production and determine the exact process tool to take out of production while the limited period of the conditional state limits the quantity of potentially defective product.