The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2002

Filed:

May. 31, 2001
Applicant:
Inventors:

James David Hensley, Rocklin, CA (US);

Stephen Daniel Cromwell, Penryn, CA (US);

Gregory S. Meyer, Roseville, CA (US);

Assignee:

Hewlett-Packard Co., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placing a structure having holes on the component, placing a number of wave springs on a corresponding number of bolts, inserting the bolts into the holes in the structure, and attaching the bolts to the substrate. A second embodiment of the invention involves a substrate with an electrical contact area, an interposer placed on the electrical contact area, a component placed on the interposer, a block having holes placed on the component, bolts and wave springs inserted in the holes, wherein the bolts and wave springs clamp the component, the interposer and the substrate together on the electrical contact area of the substrate.


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