The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2002

Filed:

Feb. 08, 2001
Applicant:
Inventors:

William E. Curran, Sr., Medinah, IL (US);

Michael T. Egan, Glen Ellyn, IL (US);

Joseph C. Weibler, West Chicago, IL (US);

Assignee:

The Curran Company, Glendale Heights, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/212 ;
U.S. Cl.
CPC ...
H01P 1/212 ;
Abstract

An EMI attenuation device comprising at least two substrates such that the spacing between these substrates is selected to maximize shielding performance at a particular frequency. The device further comprises additional substrates arranged at predetermined distances from the first two substrates to optimize shielding performance. A method also is provided for a multistep, attenuation of impinging EMI, wherein the method also enables see-through and/or hear-through monitoring. Salient features of the method include relatively positioning a plurality of electrically conductive substrates, each of a particular topology, so as to maximize attenuation of the EMI at particular frequencies.


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