The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
Apr. 18, 2000
Addi B. Mistry, Austin, TX (US);
Rina Chowdhury, Austin, TX (US);
Scott K. Pozder, Austin, TX (US);
Deborah A. Hagen, Austin, TX (US);
Rebecca G. Cole, Austin, TX (US);
Kartik Ananthanarayanan, Austin, TX (US);
George F. Carney, Mesa, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An interconnect structure, such as a flip-chip structure, including a base pad and a stud formed on the base pad and extending from the base pad is disclosed. The stud and base pad are formed to be continuous and of substantially the same electrically conductive base material. Typically, a solder structure is formed on the stud wherein the solder structure is exposed for subsequent reflow attachment to another structure. The present invention relates to packaging integrated circuits, more particularly to the structure and processing of a stud and bump without the standard under bump metallurgy.