The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2002

Filed:

Aug. 06, 1998
Applicant:
Inventors:

Kenji Hatada, Shiga, JP;

Manichi Yuuki, Shiga, JP;

Norio Tanaka, Shizouka, JP;

Masanori Ueda, Shiga, JP;

Toshio Yasuda, Shiga, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/606 ;
U.S. Cl.
CPC ...
C23C 1/606 ;
Abstract

A process for producing a metal evaporated article, which includes a metallization step of evaporating a metal and depositing the evaporated metal onto a continuously running substrate and an auxiliary material deposition step of evaporating an auxiliary material contained in an evaporator and depositing the evaporated auxiliary material onto the continuously running substrate, before or after the metallization step, comprising the steps of detecting the pressure of the atmosphere where the auxiliary material evaporated from the evaporator exists, and controlling the evaporation condition of the auxiliary material in the evaporator based on the information concerning the detected pressure.


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