The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2002

Filed:

Jul. 26, 1999
Applicant:
Inventors:

Don Doutre, Kingston, CA;

Gary Hay, Ontario, CA;

Peter Wales, Kingston, CA;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D 2/704 ;
U.S. Cl.
CPC ...
B22D 2/704 ;
Abstract

A metallic alloy having a semi-solid range between the liquidus temperature and the solidus temperature of the metallic alloy is processed by cooling the metallic alloy from an initial metallic alloy elevated temperature to a semi-solid temperature of less than the liquidus temperature and more than the solidus temperature, and maintaining the metallic alloy at the semi-solid temperature for a sufficient time to produce a semi-solid structure in the metallic alloy of a globular solid phase dispersed in a liquid phase. The cooling may be accomplished by providing a crucible at a crucible initial temperature below the solidus temperature, pouring the metallic alloy into the crucible, and allowing the metallic alloy and the crucible to reach a thermal equilibrium between the liquidus temperature and the solidus temperature of the metallic alloy. The method further includes removing at least some, but not all, of the liquid phase present in the semi-solid structure of the metallic alloy to form a solid-enriched semi-solid structure of the metallic alloy, and forming the metallic alloy having the solid-enriched semi-solid structure into a shape.


Find Patent Forward Citations

Loading…