The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
Mar. 09, 2000
Applicant:
Inventors:
Hideo Mitsuhashi, Tokyo, JP;
Katsuhisa Ookawa, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 2/572 ;
U.S. Cl.
CPC ...
G01N 2/572 ;
Abstract
A method for inspecting a connection state of an electronic part and an apparatus for the same which permits judgement of the quality of the connection state at high accuracy without needing structural addition of through holes and pads for use in connection state inspection are provided. The has the steps of: heating a first specific position on the electronic part, measuring a temperature rise of a second specific position thermally coupled to the first specific position, and judging the quality of the connection state of the solder connecting portion by comparing the measured temperature rise and a reference temperature rise.