The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2002
Filed:
Aug. 18, 2000
Valerie Vivares, Palo Alto, CA (US);
Robert Newman, Santa Clara, CA (US);
Edwin R. Fontecha, San Jose, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method of electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically conductive tie bars, comprises steps of covering and electrically contacting a first one of the circuit patterns with a first layer of electrically conductive material, applying an electrical potential to the first layer of electrically conductive material to effect electroplating on the second one of the circuit patterns, removing the first layer of electrically conductive material, covering and electrically contacting the second one of the circuit patterns with a second layer of electrically conductive material, applying an electrical potential to the second layer of electrically conductive material to effect electroplating on the first one of the circuit patterns, and removing the second layer of electrically conductive material.