The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2002
Filed:
Sep. 28, 2001
Hiroshi Shirai, Saitama, JP;
Shintaro Abe, Chiba, JP;
Tyco Electronics, AMP, K.K., Kanagawa, JP;
Abstract
An IC socket is provided which can absorb the difference in linear expansion coefficient between the housing and the circuit board, and thus prevent the occurrence of solder cracking and warping, without lowering the strength of the housing. First slits which have bottoms and which extend from the upper surface of the housing toward the undersurface of the housing are formed between specified rows of pin receiving openings which are formed in the upper surfaces of contact press-fitting accommodating holes that are arranged in the form of a matrix. These holes pass entirely through the housing from the upper surface to the undersurface. Second slits which have bottoms and which extend from the undersurface of the housing toward the upper surface of the housing are formed between specified rows of solder ball receiving cavities formed in the undersurfaces of the contact receiving cavities in positions where the first slits are not formed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile