The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Jun. 20, 1997
Shun-lung Chao, Plano, TX (US);
Sun Microsystems, Inc., Palo Alto, CA (US);
Abstract
A heatsink for dissipating thermal energy generated by a microprocessor and neighboring peripheral components. The heatsink is affixed to a printed circuit board within a computer housing. The heatsink includes a thermally conductive base, a plurality of thermally conductive fins, and a heat pipe. The thermally conductive base includes substantially planar upper and lower surfaces displaced from each other by a thickness of the base. The base defines a first channel, proximal to the lower surface, extending from a first end of the base to a second end. The plurality of conductive fins extends substantially perpendicularly from the upper surface of the base. Each of the plurality of fins includes substantially planar proximal and distal major surfaces displaced from each other by a thickness of the fin. The heat pipe is contained within the first channel. The heat pipe includes an elongated casing containing a heat transfer medium and a wick. The wick is immersed in the medium extending along a major access of the heat pipe. The heatsink is configured to be affixed to the printed circuit board with the heat pipe aligned over the center of the microprocessor and the lower surface of the heatsink in close proximity with an upper surface of the microprocessor.