The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2002

Filed:

Dec. 20, 2000
Applicant:
Inventor:

Kyoji Moro, Chiba-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 1/02 ;
U.S. Cl.
CPC ...
H05B 1/02 ;
Abstract

This reflow soldering apparatus comprises a heater tip for soldering sites to be soldered of a workpiece W by reflow method, a power supply unit for supplying an electric power for heat generation or heating to the heater tip, a control unit for providing a control of the supplied current in the power supply unit, and a pressing unit for pressing the heater tip against the sites to be soldered of the workpiece W. An inverter of the power supply unit has four transistor switching elements. By the control unit by way of a driving circuit, the first set of switching elements and are simultaneously switching (ON/OFF) controlled at a predetermined inverter frequency (e.g., 10 kHz) in response to in-phase inverter control signals G and G , whereas the second set of switching elements are simultaneously switching controlled at the inverter frequency in response to in-phase inverter control signals G and G .


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