The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Oct. 02, 2000
Yaoling Pan, Sunnyvale, CA (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
An apparatus having a heating circuit including a resistor layer and a patterned conductor layer is disclosed. The pattern defines a current path that includes at least one portion of the resistor layer. When current is applied to the current path, heat is generated in the portion of the resistor layer that is a part of the current path. The heat is used to reflow solder to connect two components such as an integrated circuit chip (IC) to a multi-chip module (MCM) module. This localized electric heating method may be used to package multiple chips on a module. The apparatus having the heating circuit may be fabricated by first depositing a resistor layer on to a substrate. Then, a conductor layer is deposited and etched to define the current path.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile