The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2002

Filed:

Nov. 29, 2000
Applicant:
Inventors:

Hiroshi Okamoto, Owari-asahi, JP;

Shin-ichi Inoue, Tokoname, JP;

Tetsuo Kanagawa, Otsu, JP;

Masataka Sano, Hamamatsu, JP;

Hiroki Miyamatsu, Hamamatsu, JP;

Kimi Yoshida, Hamamatsu, JP;

Assignee:

Kabushiki Kaisha Erubu, Hamamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D01F 8/00 ;
U.S. Cl.
CPC ...
D01F 8/00 ;
Abstract

A joining type composite molding is disclosed, containing an internal component X and an external component Y, wherein the internal component X is formed from a first resin (H); the external component Y is formed from a second resin (L) compounded with at least one functional component (A) selected from the group consisting of a catechin, a saponin, a tea-leaf powder, a tea-leaf extract and tannin (tannic acid), and a ceramics component (C); and the first resin (H) and the second resin (L) are resins falling into different categories respectively, or a resin of the same category of a non-polyolefinic resin.


Find Patent Forward Citations

Okamoto, Hiroshi. (2002). Composite molding and process for the production of the same (U.S. Patent No. 6423408). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6423408

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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