The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Dec. 11, 1998
Jun Bo Yoon, Taejon, KR;
Jae Duk Lee, Taejon, KR;
Chul Hi Han, Taejon, KR;
Choong Ki Kim, Taejon, KR;
Doo Won Seo, Seoul, KR;
Korea Advanced Institute of Science and Technology, Taejon, KR;
Abstract
Disclosed is an ink jet print head and a method of producing the same, the ink jet print head including a plurality of ink ejecting orifices which are formed with a desired shape and a uniform size by only once using metal plating technique, having an excellent productivity and a low manufacturing cost. According to a first embodiment of the present invention, in the steps for forming an improved metal barrier layer, which is comprised of the conventional barrier layer and the conventional nozzle plate combined together, the metal barrier layer can be formed on a wetting layer by using electrolytic plating or electroless plating of Ni. As a result, an upper surface of a first photoresist mold is completely covered with the overflowing Ni. Further, an upper portion of a second photoresist mold is partially covered with the overplating Ni and is partially opened at a proper size and a desired shape. Thereby, an ink ejecting orifice is created at the upper portion of the second photoresist mold. Alternatively, according to a second embodiment of the present invention, by forming a third photoresist mold at a predetermined position in which the ink ejecting orifice will be formed, the overflowing Ni is formed around the third photoresist mold, and thereby the ink ejecting orifice is created. The ink ejecting orifice has a desired shape, a uniform size and a high sectional height, which are adapted to provide an optimum ejection of the ink.