The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Dec. 09, 1997
Satoru Fukunaga, Tenri, JP;
Hiroyuki Nakanishi, Tenri, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A jig used for assembling semiconductor devices has an arrangement wherein the first semiconductor integrated circuit chip, which is die-bonded and wire-bonded onto one surface of a lead frame, is fitted to the inner section of a support stage and is supported by an elastic member that is designed to be higher than the inner section, while the lead frame is supported by the outer section of the support stage. In this state, the second semiconductor integrated circuit chip is die-bonded onto the other surface of the lead frame by applying pressure by means of a bonding collet. Thus, it becomes possible to prevent cracks that may be caused in a passivation film and also to improve the reliability and the final yield of semiconductor devices.