The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2002

Filed:

Jun. 22, 1999
Applicant:
Inventors:

Yoshihiro Ikefuji, Kyoto, JP;

Shigemi Chimura, Kyoto, JP;

Hiroharu Okada, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 1/906 ;
U.S. Cl.
CPC ...
G06K 1/906 ;
Abstract

Oppositely arranged bumps ( ) are electrically connected by connecting two IC chips ( ) through an anisotropic conductor ( ) to form an IC chip module ( ). With IC chip module ( ) having such structure, two IC chips ( ) provided with functions of a processing portion and an antenna are simply stacked to provide a function for communication, and arrangement of interconnection outside IC chip ( ) is not necessary. Thus, accidental breakage of the interconnection is avoided and assembly is extremely facilitated. Therefore, a circuit chip mounted card with higher reliability and reduced manufacturing cost and the like can be provided.


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