The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2002
Filed:
Jun. 06, 2000
Meng-Cheng Huang, Taipei Hsien, TW;
Chaun-Choung Technology Corp., Taipei Hsien, TW;
Abstract
An integral heat dissipating device includes a radiating plate, a fan blade and a cover. The radiating plate has a heat dissipating channel. A fan blade receiving chamber is communicated with the heat dissipating channel and a heat conductive plate is connected to the bottom of the outer wall of the heat dissipating channel. The bottom of the fan blade receiving chamber is installed with an axial hole which serves to be installed with a fan blade. The axial hole can be installed with a fan blade with power. An inclined surface is formed at the upper side of the fan blade receiving chamber. A plate shape heat tube is welded between the heat conductive plate and the bottom of the heat dissipating channel. A plurality of screw retaining posts capable of being screwedly fixed to a circuit board being suspended from the lateral side of the heat conductive plate. The cover is a thin plate with a hole for sealing the upper side of the heat dissipating channel and the fan blade receiving chamber. The hole is placed above the fan blade receiving chamber for being formed as a tilt wind opening. In the present invention, the radiating plate is made integrally and can be directly connected to the fan. The shape of the heat conductive plate may include with a heat dissipating element as required. The heat conductive glue adheres to a heat conductive medium for achieving the object of high heat dissipation and low cost.