The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2002

Filed:

Sep. 15, 2000
Applicant:
Inventors:

Naoki Tanaka, Sakai, JP;

Morio Ogura, Hirakata, JP;

Assignee:

Sanyo Electric Co., Ltd., Moriguchi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/25 ; H01L 4/1107 ;
U.S. Cl.
CPC ...
H03H 9/25 ; H01L 4/1107 ;
Abstract

An SAW device substrate and an SAW device having a larger value of K than conventional SAW device substrates can be obtained by using LiNbO represented by Eulerian angles of (18-30°, 80-100°, 35-75°) and determining the thickness H of a piezoelectric substrate and the pitch &lgr; of electrodes so that KH is at least 2.3 and at most 4.5. Alternatively, an Li B O layer is formed as a piezoelectric substrate on a surface of a glass layer to obtain an Li B O /glass structured SAW device substrate. More preferably, such Li B O that is represented by Eulerian angles of (0-45°, 85-95°, 85-95°) is employed. Furthermore, the SAW device substrate is used to form an SAW device so that the KH parameter is about 0.5.


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