The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2002

Filed:

Mar. 10, 2000
Applicant:
Inventor:

Tsutomu Koizumi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ; H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/3544 ; H01L 2/328 ;
Abstract

A semiconductor device includes a substrate having electrodes, a semiconductor element mounted on the substrate and having electrode pads, wires for respectively connecting the electrodes of the substrate and the electrode pads of the semiconductor element, and an encapsulating resin for sealing the semiconductor element and the wires. Markings are provided on the semiconductor device so as to avoid areas of the surface of the encapsulating resin which correspond to the semiconductor element and the tops of the wires. Thus, when the markings are placed upon the surface of the encapsulating resin, a reduction in the strength of the encapsulating resin due to the markings can be avoided.


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