The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2002
Filed:
Aug. 03, 1999
Taek Kim, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A surface-emitting light-emitting diode having increased light emission is provided. The surface-emitting light-emitting diode includes a substrate, a light generating layer comprising an active layer for generating light, and an upper clad layer and a lower clad layer formed on and below the active layer, respectively, a lower contact layer formed between the light generating layer and the substrate, a buffer layer formed between the lower contact layer and the substrate, a lower ohmic metal layer which ohmically contacts one side of the lower contact layer, an upper contact layer formed on the light generating layer and having a substantially sinusoidal uneven surface portion; and a light transmissive upper ohmic metal layer formed on the upper contact layer, in which the active layer is composed of GaN or AlN, the lower contact layer is composed of doped n-GaN, the upper contact layer is composed doped p-GaN, and the substantially sinusoidal uneven surface portion increases the contact area between the upper contact layer and light transmissive upper ohmic metal layer for reducing the contact resistance therebetween. Therefore, ohmic contact resistance and operating current are reduced, so that durability is improved due to the reduction of hear generated in the device. Also, light is condensed by the substantially sinusoidal uneven surface portion and thus the amount of light which is totally reflected internally is reduced. Accordingly, no additional package device is required and external quantum efficiency is increased.