The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2002

Filed:

Apr. 16, 1999
Applicant:
Inventors:

Toshiaki Yamada, Tokyo, JP;

Hiroaki Hasegawa, Tokyo, JP;

Yoshiyuki Yasukawa, Tokyo, JP;

Kenji Endou, Tokyo, JP;

Michihisa Yamada, Tokai, JP;

Yasuo Moriya, Tokyo, JP;

Tomiho Yamada, Obun, JP;

Tetsuya Itoh, Aichi, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 9/00 ;
U.S. Cl.
CPC ...
C08L 9/00 ;
Abstract

The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.


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