The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2002

Filed:

Dec. 04, 2000
Applicant:
Inventors:

Timothy Daryl Stanley, Austin, TX (US);

Peter Stanley, Austin, TX (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/130 ; H01L 2/146 ;
U.S. Cl.
CPC ...
H01L 2/130 ; H01L 2/146 ;
Abstract

This invention provides a method for producing SOI wafers by delamination comprising the steps of preparing a first wafer ( ) having an insulating layer ( ) on its both major surfaces; providing two delamination planes ( ′) in the interior of said first wafer ( ); bonding a second wafer ( ) on one side of the first wafer ( ); bonding a third wafer ( ′) on the other side of the first wafer ( ); and delaminating said second and third wafers ( ′) from said first wafer ( ) such that each of said second and third wafers ( ′) carries a SOI layer ( ′) on one of its major surfaces.


Find Patent Forward Citations

Stanley, Timothy. (2002). Method for producing soi wafers by delamination (U.S. Patent No. 6420243). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6420243

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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