The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2002
Filed:
Jan. 28, 2000
Applicant:
Inventors:
Assignee:
Seiko Instruments Inc., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/116 ;
U.S. Cl.
CPC ...
B23K 1/116 ;
Abstract
To provide an anodic bonding method which can favorably bond between members different in thermal expansion coefficient. In an anodic bonding method of applying a voltage to and bonding between a first member having a bonding film on a bonding surface and a second member closely put on the bonding surface of the first member through the bonding film in a manner that the first member is rendered as an anode, characterized in that: the bonding film is of a metal film and the second member is of a soda-lime glass, and a bonding temperature is at 100-200° C. and an application voltage is at 0.5-5.0 kV.