The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2002

Filed:

Oct. 12, 2000
Applicant:
Inventor:

Kenichi Doshita, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 3/00 ;
U.S. Cl.
CPC ...
H02G 3/00 ;
Abstract

A wiring harness bending mechanism is provided, which includes: a wiring harness; and first and second link arms each having a tubular portion to put the wiring harness therethrough, wherein a pair of convexities are formed on the first link arm and a pair of concavities to engage the convexities are formed on the second link arm. The first link arm is formed of a pair of first divided link arms connected with a hinge portion and each having a convexity, and the second link arm is formed of a pair of second divided link arms connected with a hinge portion and each having a concavity. A plate portion is provided projectingly from each of the tubular portions, and the pair of convexities are arranged on one end side of one plate portion and the pair of concavities are arranged on one end side of the other plate portion. A fixing portion is provided on each of the other end sides of the respective plate portions for mounting the first and second link arms. The wiring harness is bendably exposed between the tubular portions. The first link arm is pivotably supported by a guide rail and the second link arm slidably engages the guide rail.


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