Method of manufacturing a semiconductor device comprising a semiconductor body having a surface provided with a coil having a magnetic core

Abstract

The invention relates to a method of manufacturing a semiconductor device comprising a semiconductor body ( ) having a coil ( ) with a magnetic core ( ). By means of this method, the surface is provided with a first metallization layer ( ) having a first pattern of conduction tracks ( ) which are embedded in an insulating material ( ). A layer of a magnetic material is provided on the surface ( ), which faces away from the semiconductor body. A magnetic core is formed in said layer by means of etching. On the magnetic core and on the adjoining surface of the first metallization layer, a second metallization layer ( ) with a second pattern of embedded conduction tracks is formed in an insulating material ( ). The second pattern is connected to the first pattern in such a way that windings of the coil are formed. The first metallization layer is formed on the surface of the semiconductor body in such a manner that the surface of the metallization layer facing away from the semiconductor body is planar. The layer of magnetic material having a thickness below 50 nm is subsequently provided. The method in accordance with the invention enables coils to be manufactured which exhibit a relatively high self-induction when used at frequencies above 100 MHz.