The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2002

Filed:

Jun. 18, 1999
Applicant:
Inventors:

Yuji Hatagishi, Shizuoka, JP;

Teruhisa Norizuki, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/514 ; B29C 6/566 ; B29C 6/570 ;
U.S. Cl.
CPC ...
B29C 4/514 ; B29C 6/566 ; B29C 6/570 ;
Abstract

A method of producing a resin-molded assembly and a method of producing a double-retaining connector in which the need for an assembling operation of resin-molded products connected together by pins is obviated, and also a molding process is shortened so as to reduce the production cost. Resin materials, used respectively for the molded products, are so selected that a shrinkage coefficient of the first molded product having engagement pins can be higher than that of the second molded product having fitting holes and the first and second molded products are molded integrally with each other in an assembled condition by a multicolor molding method.


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