The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2002
Filed:
Jun. 29, 2000
Nihon New Chrome Co., Ltd., Tokyo, JP;
Abstract
The present invention provides a pyrophosphoric acid bath for use in Cu—Sn alloy plating without containing a cyanic ion comprising a reaction product (A) of an amine derivative and an epihalohydrin in a 1:1 mole ratio and a cationic surfactant (B) and, when necessary, further comprising a surface tension adjusting agent (C), a bath stabilizer (D) and an N-benzylpyridinium derivative (E) as additives. According to the bath of the present invention, by changing a bath composition of copper and tin or by employing a characteristic additive, a stable film with a silver-white, gold, copper or light black color can be obtained. By increasing tin contents in the bath, the bath can be used for lead-free solder plating. The bath is safe in handling and hygienic and, moreover, has no sewage process and environmental problems since it contains neither cyanic compound nor formaldehyde derivative.