The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
May. 22, 2000
Applicant:
Inventors:
Akira Suzuki, Odawara, JP;
Kenshiro Abe, Edsakimachi, JP;
Tadayuki Tsuda, Susono, JP;
Shinichi Sasaki, Ushiku, JP;
Shigeo Miyabe, Numazu, JP;
Kouichi Hiratsuka, Tsuchiura, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 1/500 ; B29C 6/570 ;
U.S. Cl.
CPC ...
G03G 1/500 ; B29C 6/570 ;
Abstract
A bonding method for bonding molded resin products, includes the step of bonding a first one of the molded resin products and a second one of the molded resin products by injecting resin material through a resin material injection path to a bonding portion therebetween, wherein the resin material injection path is formed in one of or both of the first resin material molded product and the second resin material molded product.